¡¤relatively low cost
¡¤relatively no harm
¡¤no potential environment matter;grade graduly decline.
¡¤security order:Bi©ƒZn©ƒIn©ƒSn©ƒCu©ƒTi©ƒAg©ƒPb
¡¤capability of melt humid to commonly lead-free component and circuitry board end adorn material.
¡¤alloy can bring into play action only if it combine existing sealing technology and stipulation.
¡¤can form credibility solder point,no oxide adulterant,dinky sealing crack.
¡¤contain each other with relativity low temperature management.
¡¤re-canker and not easily affacted by electrolytic canker act cause.
¡¤contain with copper group-board£¬nickel surface with dip-gold coat, many kinds of lead-free group-board, and lead group-board.
¡¤the product forms that alloy must possess contain solder bar,solder wire,pre-molding organ,solder ball and solder paste.
¡¤there must be plenty of metal used in alloy manufacture.
¡¤low melting point(©‚240¡æ).
¡¤good character oftransmit electricity.
¡¤easily to be repaired. |